first level inc. provides assembly and packaging services to the semiconductor and optoelectronics industries. We specialize in contract manufacturing microelectronics services such as wire bonding, bumping, flip chip, surface mount and interconnections technologies, die attachment, assembly packaging, hermetic sealing, encapsulation, under filling, and wafer dicing. We provide assistance to our customers in design, building prototypes, produce medium-to-small batches and perform failure analysis.
first level inc. provides quick turnaround prototyping services to ensure a concept, design, process, or manufacturability. Our highly experienced technical staff furnishes valuable consultation/advice at the initial phase of the program depending on a customers needs. Staff engineers and skilled technicians will provide continuous communications throughout the prototyping process.
Basic packaging schemes consist of housing and interconnections. Proper packaging can provide adequate heat sinking, electrical isolation, low noise, and/or protections against extreme environments. first level inc. offers standard and application specific packaging of microelectronic circuits in:
- Chip on Board or Chip on Flex
- Single and Multichip Modules
- QFN, QFP Packages
- Plastic and Ceramic Chip Carriers
- Open Cavity Plastic Mold Packages
- Ceramic Packages
- Kovar Packages
- Transistor Outline Cans
- Surface Mount and Through Holes
- Flip Chip, Wire Bond and Interconnections
- Peripheral Lead frame, Ball Joint Array, or Chip Scale Packages
We offer four die attachment services, epoxy, eutectic, solder and flip chip. The die attachment processes are completed in the class 10,000 clean rooms. Our staff is experienced in manual dispensing of materials at very fine scales and our equipment is capable of dispensing materials in micro dots for small components or patterns for larger components. We can dispense, screen, or stencil many different materials required for the assembly of your product.
- Machine processing of die sizes up to 2″ sq
- Pick and place die from a wafer up to 12″ in diameter, waffle packs, or gel packs
- Epoxy or flux can be used in stamping or dipping processes. Epoxy die bonding can be done using silver filled materials, non-conductive or preforms
- Eutectic die bonding using high or low temperature alloy preforms or paste
- Solder reflow can be done in either vacuum or belt furnaces up to 400℃
- Flip chip bonding can be accomplished using pick & place or more specialized methods such as thermosonic, thermionic or thermo-compression processes. We also have bumping and coining options that can be utilized in the flip chip process.
- Die Shearing – 50 gramF to 10 kgF
Stud bumping is a method for connecting semiconductor devices onto a wide range of circuit board materials. The stud bump is attached directly onto standard, wire bond pads and can be manufactured from any of the materials normally used for wire bonding.
The shape of the stud bump can be customized, for each application, to optimize electrical performance and mechanical reliability and will allow semiconductor die, with <150 micron pitch pads, to be flipped directly onto FR4, without the need for underfill.
The stud bump process is extremely cost-effective and can be carried out on individual die, either at the wafer level or after singulation. The unique manufacturing methodology can even accommodate full electrical testing, including burn-in.
Once stud bumped, the die can be attached using a wide range of techniques; thermocompression and thermosonic bonding, reflow soldering and conductive, z-axis and even non-conductive adhesives.
Our high throughput pick and place equipment can handle 0.0005” x 0.001” size components. The units can be programmed for tape and reel for up to 25 feeders.
SMT lines are equipped with epoxy or solder paste dispensing as well as mesh screen or stencil printing. The heat treatments are performed using vacuum ovens, belt furnaces, or hotplates with temperatures up to 400℃.
Post component attachment cleaning can be done using wet or dry methods. Wet cleaning is using medium-to-strong solvents with ultrasonic agitation. Dry clean, plasma utilizing oxygen or argon, is employed for contamination removal at any stage in the process.
All surface mounts are completed in compliance with IPC, JEDEC and Military Standards as per requirements.
FLI offers lid sealing service for many packaging schemes. Sealing is done utilizing one of two methods. One method is using resistive heating in which parts are placed in a heated vacuum or other desired environment. The other method is utilizing a belt furnace to heat the product in the desired environment. In both cases the lid and housing are pre-coated with solder preform. Fixture design is a key factor in this process and FLI possesses the machining capability in house to meet many of our fixturing needs quickly.
Sealed parts are carefully inspected and we can complete gross and/or fine leak check operations.
Lid seal – Transistor outline (TO) head-can, Kovar lid-housing, ceramic housing-lid
FLI offers lead attach, and trim and form to legacies products such as through holes, surface mounts, circuit boards with single side and double-sided pads.
Etched and stamped lead frames, 0.025”, 0.050”, and 0.100” fine pitch, Pb and Pb-free plates are available, clip or flat leads
Lead frames can come in continuous strip, in quads or cut to desired lengths. Single in line, dual in line and quad flat packs
Proprietary lead attachment processes are developed to attach fine pitch lead frames on already populated organic and ceramic boards. This process is being used to form interconnections for many civilian and commercial applications.
first level inc started performing failure analysis (FA) in 2014 on assemblies as per requested from customers. Before 2014 the failure analysis service was limited to internal use only. During this time we have successfully completed dozens of failure analysis for our customers.
The FA process involves detailed visual inspections of failed parts, communicating with customers on process, design, material and workmanship, performing non-destructive and destructive tests, reviewing test results, discussing findings with customers, and preparing final reports
- Ceramic or Laminates
- Single or Multiple Layers
- Thick or Thin Film
- Single or Multiple Chips
- Peripherals, Leads, or Ball Grid Arrays
- Clip Lead Frame or Flat Leads
- Solder Laden or Solderless Clip Head
- Continuous Strip, Stamped or Etched Strips, & Quads
- Single in Line, Dual in Line, and Quad Flat Packs
- 0.4mm, 0.5mm, 0.65mm, 0.025″, 0.050″, 0.100″ Pitch
- Solder ball attach
- BGA reballing
- Lead frame attach
- Flat lead frame or edge clips with pitches from 0.5mm to 1.27mm
- Solder laden lead frame
- Lead free, low or high temperature solder alloys
- Forming and trimming of leads to JEDEC specifications
- Belt furnace for solder reflow up to 400℃ in nitrogen atmosphere
- Micro flame reflow process for localized low stress reflow solder joints
Our 10,000 square foot facility contains 4,200 square feet of class 10,000 clean rooms to accommodate medium-to-small production runs for microelectronic assembly and packaging operations. State of the art equipment, flexibility of manufacturing lines, and location of our company make us an ideal contract assembly facility in the United States.
We have advanced pick and place equipment, automatic and manual wire/ribbon bonding units, vacuum and environmental solder reflow systems, and high throughput encapsulation systems to meet your high expectations.
All SMD and bare die can be manually placed by a skilled technician or, automatically by ultra precision pick and place equipment. Our pick and place equipment can handle component sizes as small as 0.0005” X 0.001”.
Our automatic pick and place machines are capable of placing one component per second with an accuracy of +/- 10 micron. Our skilled technicians can place components with +/- 25 micron accuracy.
We have die/component sorting capabilities between wafer tape and waffle pack or, from wafer tape or waffle pack to the substrate directly.
- Automatic and manual wire bond units can handle wedge, ball, stitch and tack wire bonds
- Gold and Aluminum (1 % Silicon) wires – 0.0007” to 0.014” with a minimum pad size of 60 micron
- Gold ribbon bonding up to 0.005” X 0.0005”
- Ball Bumping – Minimum 45 micron diameter, height can go from 25 micron to 75 micron
- Wire pull test 50 gramF max
We can dice various types of materials such as silicon wafers, encapsulated printed circuit boards, ceramic boards, over molded parts, soft and hard electronic boards, glass, ferrite, quartz and bare printed circuit boards.
Maximum wafer or substrate size – 6” round or square, 1mil minimum to 10mm thick.
A gap between the die and substrate after die attachment process can be filled using under fill material to provide mechanical integrity to the entire bonded structure. In some cases under fill also provides a thermal path to dissipate heat from the active die. The under fill is normally electrically non-conductive and thermally conductive.
We offer manual and automatic under fill services.
Minimum 1 mil to maximum 25 mil gap can be filled
Encapsulation processes are used to protect fragile die or wire bonds. There are two primary processes used to achieve the encapsulation. Dam and Fill is a precise method of encapsulating high input and output wire bonded die. Without the encapsulation, wire bonds would be exposed and subject to damage, rendering the product useless. Dam and fill is a two-part process consisting of a dam being dispensed first, followed by a fill material. As an alternative to dam and fill, a glob top process can be done. The primary difference between the two processes is that glob top does not utilize a dam, and, therefore, can cover a varying area on the substrate due to material flow. Typically, glob top is used on low-cost products and when the wetted area is not critical. Our dispensers are capable of dispensing dots as small as 3 mils in diameter.
We can accommodate up to 18” X 18” and up to 0.100” high with +/- 50 micron of repeatability accuracy in X-Y with our semi-automatic equipment.
Fine and gross leak testing are completed as per Military Standard specifications MIL-STD-883 and MIL-STD-750.
High boiling temperature (> 250℃) oil is used to find gross leaks in hermetically sealed electronic assemblies. A commercially manufactured Helium Mass Spectrometer detection system is used to perform fine leak testing.
- Silicon Optical Bench Assembly (SiOB)
- Laser, VCSEL & Photodetector Mounting
- Optical Alignment
- Hermetic & Non-Hermetic Sealing
- GR-468 Qualified Assembly
- TX / RX Assembly
- TOSA / ROSA Assembly
- XFP & Transponder Assembly
The package serves several competing functions to the electronics such as, integrating components, interfacing components to the overall circuit or system, provide protection from environment, support mechanically and provide thermal path for heat sink. Package design and material selection to fabricate the package play a very critical role in the reliability and performance of the device.
first level inc offers a broad range of standard and application specific microelectronics packaging schemes. We have designed and packaged devices for medical, automotive, power, sensors, telecommunications, control and defense industries for more than 15 years.
Our packaging services cover modules for optoelectronic communications, multichip modules for MEMS and sensors, high-speed radio frequency and microwave packages, transistor outline packages, Kovar packages, dual in line, hermetic power packages, flip chip package for power devices, telecom packages, hybrid packages, and chip on boards.
FLI’s engineers have the experience and creativity to deliver the most reliable and manufacturable packaging services at a low-cost and in a timely manner.
Our package design service offers design-to-prototype:
- Package design and layout
- New package development and prototype
- Process development and characterizations
- Consultations on various packaging techniques and technologies
- Technology transfer for mass production
In-house setups and third-party services are offered to validate the prototype productions. The process involves short-term and long-term reliability tests to validate design, concept, process and material integrity.
- Temperature cycling units – -40℃ to 200℃
- Shear test – 50 gram F to 10 kilogram F
- Pull test – up to 50 gram F
- Fine leak check – Helium Mass Spectrometer, MIL STD 883, 750
- Gross leak check – up to 250℃
- Profile projector
- Z – Scope up to 40X
- Light engine test – up to 50 VDC, 3 A, 10℃ to 40℃
- X-Ray, acoustic imaging, SEM, EDS, metallographic cross sectioning, decapsulation, delayering, solderability, shock and vibration, resistance to solvent and particle impact noise detection tests can completed as required.
- Emphasizing Quality
- Cost Reduction
- Failure Analysis
Tool design and fabrication are critical parts of process development. We design all of our tooling and fixtures in-house. Most tools and fixtures are fabricated on site and we have long-standing proprietary relationships with tooling houses. We have the hands-on knowledge and skill sets to fabricate prototype and production tooling in-house.
The in-house machine shop and machining expertise give us an opportunity to be more competitive in the market in terms of pricing.