first level inc. provides assembly and packaging services to the semiconductor and optoelectronics industries. We specialize in contract manufacturing microelecronics services such as wire bonding, bumping, flip chip, surface mount and interconnections technologies, die attachment, assembly packaging, hermetic sealing, encapsulation, under filling, and wafer dicing. We provide assistance to our customers in design, building prototypes, produce medium-to-small batches and perform failure analysis.
- Chip on Board or Chip on Flex
- Single and Multichip Modules
- QFN, QFP Packages
- Plastic and Ceramic Chip Carriers
- Open Cavity Plastic Mold Packages
- Ceramic Packages
- Kovar Packages
- Transistor Outline Cans
- Surface Mount and Through Holes
- Flip Chip, Wire Bond and Interconnections
- Peripheral Lead frame, Ball Joint Array, or Chip Scale Packages
- Machine processing of die sizes up to 2″ sq
- Pick and place die from a wafer up to 12″ in diameter, waffle packs, or gel packs
- Epoxy or flux can be used in stamping or dipping processes. Epoxy die bonding can be done using silver filled materials, non-conductive or preforms
- Eutectic die bonding using high or low temperature alloy preforms or paste
- Solder reflow can be done in either vacuum or belt furnaces up to 400℃
- Flip chip bonding can be accomplished using pick & place or more specialized methods such as thermosonic, thermionic or thermo-compression processes. We also have bumping and coining options that can be utilized in the flip chip process.
- Die Shearing – 50 gramF to 10 kgF
The shape of the stud bump can be customized, for each application, to optimize electrical performance and mechanical reliability and will allow semiconductor die, with <150 micron pitch pads, to be flipped directly onto FR4, without the need for an underfill.
The stud bump process is extremely cost effective and can be carried out on individual die, either at the wafer level or after singulation. The unique manufacturing methodology can even accommodate full electrical testing, including burn-in.
Once stud bumped, the die can be attached using a wide range of techniques; thermocompression and thermosonic bonding, reflow soldering and conductive, z-axis and even non-conductive adhesives.
SMT lines are equipped with epoxy or solder paste dispensing as well as mesh screen or stencil printing. The heat treatments are performed using vacuum ovens, belt furnaces, or hotplates with temperatures up to 400℃.
Post component attachment cleaning can be done using wet or dry methods. Wet cleaning is using medium-to-strong solvents with ultrasonic agitation. Dry clean, plasma utilizing oxygen or argon, is employed for contamination removal at any stage in the process.
All surface mounts are completed in compliance with IPC, JEDEC and Military Standards as per requirements.
Sealed parts are carefully inspected and we can complete gross and/or fine leak check operations.
Lid seal – Transistor outline (TO) head-can, Kovar lid-housing, ceramic housing-lid
Etched and stamped lead frames, 0.025”, 0.050”, and 0.100” fine pitch, Pb and Pb-free plates are available, clip or flat leads
Lead frames can come in continuous strip, in quads or cut to desired lengths. Single in line, dual in line and quad flat packs
Proprietary lead attachment processes are developed to attach fine pitch lead frames on already populated organic and ceramic boards. This process is being used to form interconnections for many civilian and commercial applications.
The FA process involves detailed visual inspections of failed parts, communicating with customers on process, design, material and workmanship, performing non-destructive and destructive tests, reviewing test results, discussing findings with customers, and preparing final reports
- Ceramic or Laminates
- Single or Multiple Layers
- Thick or Thin Film
- Single or Multiple Chips
- Peripherals, Leads, or Ball Grid Arrays
- Clip Lead Frame or Flat Leads
- Solder Laden or Solderless Clip Head
- Continuous Strip, Stamped or Etched Strips, & Quads
- Single in Line, Dual in Line, and Quad Flat Packs
- 0.4mm, 0.5mm, 0.65mm, 0.025″, 0.050″, 0.100″ Pitch
- Solder ball attach
- BGA reballing
- Lead frame attach
- Flat lead frame or edge clips with pitches from 0.5mm to 1.27mm
- Solder laden lead frame
- Lead free, low or high temperature solder alloys
- Forming and trimming of leads to JEDEC specifications
- Belt furnace for solder reflow up to 400℃ in nitrogen atmosphere
- Micro flame reflow process for localized low stress reflow solder joints
Our automatic pick and place machines are capable of placing one component per second with an accuracy of +/- 10 micron. Our skilled technicians can place components with +/- 25 micron accuracy.
We have die/component sorting capabilities between wafer tape and waffle pack or, from wafer tape or waffle pack to the substrate directly.
- Automatic and manual wire bond units can handle wedge, ball, stitch and tack wire bonds
- Gold and Aluminum (1 % Silicon) wires – 0.0007” to 0.014” with a minimum pad size of 60 micron
- Gold ribbon bonding up to 0.005” X 0.0005”
- Ball Bumping – Minimum 45 micron diameter, height can go from 25 micron to 75 micron
- Wire pull test 50 gramF max
Maximum wafer or substrate size – 6” round or square, 1mil minimum to 10mm thick.
We offer manual and automatic under fill services.
Minimum 1 mil to maximum 25 mil gap can be filled
Encapsulation processes are used to protect fragile die or wire bonds. There are two primary processes used to achieve the encapsulation. Dam and Fill is a precise method of encapsulating high input and output wire bonded die. Without the encapsulation, wire bonds would be exposed and subject to damage, rendering the product useless. Dam and fill is a two-part process consisting of a dam being dispensed first, followed by a fill material. As an alternative to dam and fill, a glob top process can be done. The primary difference between the two processes is that glob top does not utilize a dam, and, therefore, can cover a varying area on the substrate due to material flow. Typically, glob top is used on low cost products and when the wetted area is not critical. Our dispensers are capable of dispensing dots as small as 3 mils in diameter.
We can accommodate up to 18” X 18” and up to 0.100” high with +/- 50 micron of repeatability accuracy in X-Y with our semi-automatic equipment.
High boiling temperature (> 250℃) oil is used to find gross leaks in hermetically sealed electronic assemblies. A commercially manufactured Helium Mass Spectrometer detection system is used to perform fine leak testing.
- Silicon Optical Bench Assembly (SiOB)
- Laser, VCSEL & Photodetector Mounting
- Optical Alignment
- Hermetic & Non-Hermetic Sealing
- GR-468 Qualified Assembly
- TX / RX Assembly
- TOSA / ROSA Assembly
- XFP & Transponder Assembly
first level inc offers a broad range of standard and application specific microelectronics packaging schemes. We have designed and packaged devices for medical, automotive, power, sensors, telecommunications, control and defense industries for more than 15 years.
Our packaging services cover modules for optoelectronic communications, multichip modules for MEMS and sensors, high speed radio frequency and microwave packages, transistor outline packages, Kovar packages, dual in line, hermetic power packages, flip chip package for power devices, telecom packages, hybrid packages, and chip on boards.
FLI’s engineers have the experience and creativity to deliver the most reliable and manufacturable packaging services at a low cost and in a timely manner.
Our package design service offers design-to-prototype:
- Package design and layout
- New package development and prototype
- Process development and characterizations
- Consultations on various packaging techniques and technologies
- Technology transfer for mass production
- Temperature cycling units – -40℃ to 200℃
- Shear test – 50 gram F to 10 kilogram F
- Pull test – up to 50 gram F
- Fine leak check – Helium Mass Spectrometer, MIL STD 883, 750
- Gross leak check – up to 250℃
- Profile projector
- Z – Scope up to 40X
- Light engine test – up to 50 VDC, 3 A, 10℃ to 40℃
- X-Ray, acoustic imaging, SEM, EDS, metallographic cross sectioning, decapsulation, delayering, solderability, shock and vibration, resistance to solvent and particle impact noise detection tests can completed as required.
- Emphasizing Quality
- Cost Reduction
- Failure Analysis
The in-house machine shop and machining expertise give us an opportunity to be more competitive in the market in terms of pricing.