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first level inc. provides assembly and packaging services to the semiconductor and optoelectronics industries. We specialize in contract manufacturing microelecronics services such as wire bonding, bumping, flip chip, surface mount and interconnections technologies, die attachment, assembly packaging, hermetic sealing, encapsulation, under filling, and wafer dicing. We provide assistance to our customers in design, building prototypes, produce medium-to-small batches and perform failure analysis.

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Prototype
Packaging Assembly
Die Attachment
Stud Bumping
Surface Mount Technologies Assembly
Hermetic Lid Sealing
Lead Attach, and Trim and Form
Failure Analysis
Substrate Design
Lead Frame Design
Peripherals

Production
Precision Component Placement
Wire Bonding
Dicing
Under Fill and Encapsulation
Fine and Gross Leak Testing
Optoelectronics Technology
Package Design
Design Validation
Consulting
Tooling Design and Fabrication