first level inc. is a leader in the contract microelectronic packaging industry. For over 18 years we have been producing and assembling quality products for industries including: medical electronics, optoelectronics, automotive sensors, military and aerospace, microwave and RF, chip carriers and interposers, hybrid, multi chip and custom modules. We are conveniently located in South Central Pennsylvania, a short distance from Baltimore, Philadelphia, or Harrisburg.
The advanced training of our technical staff, well-documented operating procedures and process controls coupled with the finest high speed manufacturing equipment guarantee the highest product quality.
Our customers come to us with a product, we design the manufacturing process, select the proper materials and deliver a reliable, defect-free product.
In our ESD protected clean rooms, microelectronics devices are assembled using the most up-to-date IC assembly technologies.
As Part of Your Team
We can assist with the following: packaging design and layout, process development, material selection, and process optimization. We utilize our resources to develop and qualify a production process in the shortest time frame possible, at the lowest possible cost to the customer. The flexibility of our equipment allows us to solve most problems related to the microelectronics packaging industry. We can deliver a reliable product that meets or exceeds customer expectations.
first level inc. is a powerful partner in bringing your product to market efficiently and successfully.