Applications

fli has extensive experience in many aspects of microelectronic packaging. Many of our customers come to us for our exceptional quality and attention to detail. Choose any of the headings in the image to see more about the projects we have worked on.

MEDICAL DEVICES

Our past assembly projects have included RFID tags, glucose monitors, pregnancy testers, brain probes, DNA readers, CMOS cameras, and gas sensors

  • RFID Tags
  • Sensors
  • Testers
  • Probes
  • CMOS Cameras

TRANSPORTATION SENSORS

Hall Effect sensors, bolometers, GYRO MEMS, and pressure sensors for defense and commercial applications

  • Hall Effect Sensors
  • GYRO MEMS
  • Pressure Sensors
  • Bolometer

INTERPOSERS

FLI provides assistance in design and procurements of standard and application specific interposers.
Materials include ceramic, metal-ceramic, FR4, poly, composites of FR4, and Rogers

LIGHT ENGINES

Our assembly services include 7 cavity light engines, multichip (array) LED light engines, Photo IC, infrared light assemblies, UV light engines for chemical cure, photo detectors, UV light detectors, and avalanche photodiodes

  • Multi-Cavity Light Engine
  • LED Light Engine
  • UV Light Engine
  • Avalanche Photodiodes
  • IR Detectors

MILITARY

Discrete device packaging for Fuze applications, multichip module power converters, GYRO device assemblies for military transportation applications, RF and microwave communications assemblies, and assemblies for satellite applications

AEROSPACE

Our experience includes chip-on-board with mirror cavity for deep space spectroscopy and black hole photo detector assemblies

  • Deep Space Spectroscopy COB
  • Black Hole Photodetector
  • Satellite Communication Circuits

CHIP CARRIERS

Design and procurement of ceramic, organic material based, and metal-ceramic based chip carries

CUSTOM MODULES

System-in-package (SiP), chip-on-board (COB), multichip modules, electromechanical systems, and application specific electronics modules

  • SiP
  • MCM
  • MEMS
  • LCC
  • BGA
  • CSP
  • Power Discrete
  • Open Cavity Plastic Packages
  • Chip on Flex (COF)
  • Gull Wing

OPTOELECTRONICS

We can provide assembly and packaging of APD detectors, photometer and IC assemblies, TO can and header assemblies, laser-die assemblies, electromechanical assemblies for pattern recognition, photomultiplier assemblies and optoelectronics modules

  • Fiber Optics Communication Assemblies
  • InP Detector
  • Photometer-IC Assemblies
  • TO Can-Header Packaging
  • Laser SMT Assemblies
  • Optoelectronics Modules
  • Electromechanical Assemblies
  • TEC-Submounted Die Packaging
  • Silicon Optical Bench Assembly (SiOB)
  • Laser, VCSEL & Photodetector Mounting
  • Optical Alignment
  • Hermetic & Non-Hermetic Sealing
  • GR-468 Qualified Assemblies
  • TX / RX Assemblies
  • TOSA / ROSA Assemblies
  • XFP & Transponder Assemblies

MULTICHIP MODULES (MCM)

  • Si & SiC Power Converters
  • TX and RX Stacked Multichip Modules
  • Dual Chip Probe Modules
  • AC-DC & DC-DC Converters
  • Satellite COM Circuits (Stacked die interconnections)
  • B-State Epoxy Applications

HYBRID MODULES

FLI employs standard and hybrid electronic modules to realize the optimum size, weight and power by applying flip-chip, chip & wire bond, chip-on-board (COB), surface mount technology and lead frame attachments

  • RF Modules
  • Power Converter Modules
  • VCSEL Modules

RF & MICROWAVE

We can assemble T/R and SPDT switches, hermetic and non-hermetic feed thru installments, PIN diode assemblies, GaAs, SiC and GaN die attachments, ribbon wire bond, and thermosonic flip-chip die attachment

  • T/R Switches
  • SPDT Switches
  • Feed Thru Installments
  • GaAs, SiC and GaN Die Attachments