We have equipment for basic Flip Chip placement, thermosonic, and thermocompression attachments. Flux application is achieved via print, stamp, or dipping. When board flatness is a concern additional solder can be stenciled before placement of the chip. After reflow a cleaning process is completed in preparation for Underfill.
If your product includes other components we can often complete all of those attachments in one machine. Precision Component Attach
If your die requires Bumping and/or Coining we have that process covered as well.