Packaging Assembly

Packaging Assembly

Basic packaging schemes consist of housing and interconnections. Proper packaging can provide adequate heat sinking, electrical isolation, low noise, and/or protections against extreme environments. first level offers standard and application specific packaging of microelectronic circuits in:

  • Chip on Board or Chip on Flex
  • Single and Multichip Modules
  • QFN, QFP Packages
  • Plastic and Ceramic Chip Carriers
  • Interposers
  • Open Cavity Plastic Mold Packages
  • Ceramic Packages
  • Kovar Packages
  • Transistor Outline Cans
  • Surface Mount and Through Holes
  • Flip Chip, Wire Bond and Interconnections
  • Peripherals – Lead Frame, Ball Grid Array, or Chip Scale Packages

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