first level provides assembly and packaging services to the semiconductor and optoelectronics industries. We specialize in contract manufacturing of microelectronics providing services such as wire bonding, bumping, flip chip, surface mount and interconnections technologies, die attachment, assembly packaging, hermetic sealing, encapsulation, under filling, and custom dicing of various materials.

With inhouse engineers we can provide assistance to our customers in design and assembly of new products as well as being able to troubleshoot technical issues in current designs.

Our tool shop allows us to fabricate and modify fixtures on premises saving time and money.

20+yrs as a small family owned business located in York, Pennsylvania. We can handle everything from design assistance, to production of quality electronic assemblies. Let our experience be your success.