first level provides assembly and packaging services to the semiconductor and optoelectronics industries. We specialize in contract manufacturing microelectronics services such as wire bonding, bumping, flip chip, surface mount and interconnections technologies, die attachment, assembly packaging, hermetic sealing, encapsulation, under filling, and wafer dicing. We provide assistance to our customers in design, building prototypes, production of medium-to-small batches and performing failure analysis.