Dicing

Dicing

We can dice various types of materials on our dicing saws. Our MicroAutomation 1100 & 1500 saws can run up to 6″ cutting area while our ADT7100 allows us up to an 8″ cutting area with higher speed processing. Materials such as silicon wafers, PCBs, encapsulated PCBs, ceramic boards, AlN, BeO, over molded parts, soft and hard electronic boards, silicon carbide, glass, ferrite, quartz and bare printed circuit boards can all be diced in our facility.